
Search by job, company or skills
Showing 4 jobs
Skills:
flip chip, wirebond, power SiP modules, Discrete FET packages, yield analysis, singulation, multi-chip modules, semiconductor package assembly processes, Smt, wide-bandgap packaging, package process qualification methods, power packaging, Molding, SiC, process control methodologies, Spc, DBC, advanced packaging technologies, Doe, Power Modules, statistical analysis tools, AMB, wafer-level packaging, GaN, Vertical Power Stages, Smart Power Stages
Skills:
Panasonic mounting machine, SMT machine management, DEK Printer, Rehm Reflow, Parmi SPI, ViTrox, KohYoung
Skills:
thought leadership , case studies , advanced Excel, Microsoft 365, Webinars, Power Bi, campaigns, Word, packaging solutions, marketing programs, Events, Powerpoint, B2b Marketing, Sales Enablement, Data Analysis
Skills:
Die Casting, Project Management, Sheet Metal, Plastic Injection Molding, PCB Assembly
