Test Documentation, logic analyzers, Oscilloscopes, DPPM improvement, cycling execution, Multimeter, Failure Analysis

Documentation like PCB Guidelines Processes Checklists and Training materials, Design for Manufacturing Assembly and Test, CAM setup and Gerber generation, Preparation of Fabrication and Assembly Drawings, Constraints and use of the constraint manager, Through–Hole Blind Buried Micro Power vias in PCB, Edge-Coupled and Broadside-Coupled Differential pairs and Designed impedance, High speed PCB Design using Cadence Allegro PCB Editor, Net Pin pair and combination-net Xnets length matching, Critical signal routing cross talks EMI EMC Clock signal Mixed Signal Routings and Power plane distribution

New product introduction (NPI), Flip Chip assembly, Process Optimization, Process Documentation, Failure Analysis, Process characterization, Reliability Testing, process transfer, Continuous improvement initiatives, Underfill processes, Solder bump micro-bump technology

Environmental Stress Screening (ESS), Perl, Functional Test, Python, Test hardware and software, Equipment verification and integration, Process Documentation, Failure Analysis

System Level Test (SLT), Java, Unix, Data Analytics, Shell, Linux, Automation Frameworks, Python, Root-cause debug, Test infrastructure development, LLMs, AI Agents, Test content strategies, Manufacturing test, Machine learning applications, AI-driven automation, characterization, Failure Analysis, Silicon bring-up, Product Validation