Engineer, Process Development Engineering

About Analog Devices

Analog Devices, Inc. (NASDAQ:) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $9 billion in FY24 and approximately 24,000 people globally, ADI ensures today's innovators stay Ahead of What's Possible. Learn more atand onand.

1. Develop, qualify, and optimize Die Attach and Flip Chip assembly processes for semiconductor packaging.

2. Provide process engineering support for production lines, including troubleshooting yield and quality issues.

3. Perform process characterization, DOE (Design of Experiments), and process optimization to improve performance and reliability.

4. Support new product introduction (NPI) and process transfer from development to high-volume manufacturing.

5. Work closely with equipment, materials, and product engineering teams to resolve process-related issues.

6. Establish and maintain process documentation, specifications, and control plans.

7. Drive continuous improvement initiatives to enhance yield, productivity, and cycle time.

8. Analyze failure modes and reliability concerns related to die attach and flip chip processes.

9. Interface with equipment vendors and material suppliers to qualify new technologies and improvements.

10. Ensure compliance with quality standards and manufacturing best practices.

Qualifications

1. Bachelors or Masters degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.

2. 310 years of experience in semiconductor packaging or assembly manufacturing.

3. Hands-on experience with Die Attach and Flip Chip processes in a production environment.

4. Strong knowledge of:

a. Die bonding techniques

b. Flip chip assembly

c. Underfill processes

d. Solder bump / micro-bump technology

e. Familiarity with advanced packaging technologies is an advantage (e.g., WLCSP, BGA, SiP, 2.5D/3D packaging).

5. Strong problem-solving and cross-functional communication skills.

6. Experience with die attach equipment (ASM, BESI, Datacon, etc.).

7. Familiarity with reliability testing and failure analysis.

Job Req Type: Experienced

Required Travel: Yes, 10% of the time

Shift Type: Normal Time (Philippines)