Infinecs is looking for a hands‑on Package Design Engineer. This role involves lead‑frame and substrate package layout, with close supplier collaborations, and delivering manufacturable designs using industry‑standard CAD tools.
Requirements:
- Minimum 5 years of relevant experience in semiconductor package design or related fields.
- Bachelor's or Master's degree in Electrical Engineering or a related field.
- Proven capability in designing semiconductor packages, including lead‑frame and substrate laminate packages, covering package layout design, lead‑frame drawing/drafting, and wire bonding schemes.
- Proficient in CAD design tools, including AutoCAD for lead‑frame design and drafting, and Cadence tools for substrate laminate package design.
- Familiarity with current industry trends and emerging technologies in lead‑frame and substrate laminate packaging is an added advantage.
- Experience working with or coordinating alongside lead‑frame and substrate suppliers.
- Strong communication and collaboration skills, with the ability to work effectively across cross‑functional teams.
- High attention to detail, with the ability to maintain accurate, complete, and well‑organized design documentation and reporting.
