Search by job, company or skills

Engineer, Product Development Engineering

Engineer, Product Development Engineering

Sandisk
  • Posted 2 hours ago
  • Be among the first 10 applicants

Job Description

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and tomorrow's next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we're living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

Description

ESSENTIAL DUTIES AND RESPONSIBILITIES: 3D NAND test solution design, assessment, development, and maintenance, including hardware, software, and data analysis. R&D and MP program development on multiple platforms including Advantest T5773, T5831 series, & In house designed platforms. Test Equipment bring-up and correlation for new packages, including DSA design, pin & channel mapping. Product-specific flow creation and integration to meet HVM requirements. R&D activities from pre-silicon to post-silicon, including Design Validation, Engineering Evaluation, Qualification Support, and Failure Analysis. Engineering investigation and resolution on design/process/packaging issues. RMA failure mode analysis and screen coverage improvements. Test data correlation between platforms. Yield enhancement and test time optimization. Collaboration internally across multiple departments, such as PE, Device, Packaging, and Design, as well as with external ATE vendors and related parties for debugging and related engineering activities. In-house designed platform and new test equipment validation, production environment setup.

Additional Information

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [Confidential Information] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

Key Skills

DSA design

Advantest T5773

Engineering Evaluation

Test Equipment bring-up

Design Validation

test data correlation

production environment setup

Product-specific flow creation

pin channel mapping

3D NAND test solution design

HVM requirements

test equipment validation

Qualification Support

RMA failure mode analysis

test time optimization

About Company

Similar Jobs

Penang, Malaysia, George Town
Skills:
Test Documentation, Comprehension of design manuals and data sheets, Logic analyzers, Oscilloscopes, Reliability test execution, Failure Analysis, Multimeter
Penang, Malaysia
Skills:
Microsoft Office, Machine Repair, Machine observation, Machine setup, Data Analysis, Mechanical installation, Troubleshooting, Reporting, Customer Management, Critical Thinking, Machine log evaluation, Machine tuning
Penang, Malaysia
Skills:
New product introduction (NPI), Flip Chip assembly, Process Optimization, Process Documentation, Failure Analysis, Process characterization, Reliability Testing, process transfer, Continuous improvement initiatives, Underfill processes, Solder bump micro-bump technology
2-3 yrs
Perai, Penang, Malaysia
Skills:
Environmental Stress Screening (ESS), Perl, Functional Test, Python, Test hardware and software, Equipment verification and integration, Process Documentation, Failure Analysis